US 12,278,248 B2
Image sensor package and method of fabricating the same
Bongjin Son, Asan-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 26, 2021, as Appl. No. 17/240,131.
Claims priority of application No. 10-2020-0130444 (KR), filed on Oct. 8, 2020.
Prior Publication US 2022/0115426 A1, Apr. 14, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 23/00 (2006.01); H04N 23/54 (2023.01)
CPC H01L 27/14618 (2013.01) [H01L 23/562 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H04N 23/54 (2023.01)] 15 Claims
OG exemplary drawing
 
1. An image sensor package, comprising:
a package substrate;
an image sensor chip mounted on the package substrate;
a transparent cover on the image sensor chip;
an encapsulant encapsulating the image sensor chip and covering a side surface of the transparent cover;
a dam on an upper surface of the image sensor chip and surrounding an outer portion of the upper surface of the image sensor chip, the transparent cover on the dam;
a bonding wire electrically connecting a chip pad of the image sensor chip to a substrate pad of the package substrate, the dam covering a first end of the bonding wire connected to the chip pad; and
a stress reducing layer covering a second end of the bonding wire connected to the substrate pad, the stress reducing layer including a same material as the dam,
wherein the dam comprises a different material than the encapsulant, and
wherein the encapsulant directly contacts and covers a middle portion of the bonding wire between the first end covered by the dam and the second end covered by the stress reducing layer.