| CPC H01L 25/0753 (2013.01) [H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01)] | 19 Claims |
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1. A driving substrate, wherein the driving substrate is divided into a device disposing area, a bending area, and a bonding area; the bending area is located between the device disposing area and the bonding area;
each of a section of the driving substrates located in the device disposing area, a section of the driving substrate located in the bending area, and a section of the driving substrate located in the bonding area comprises a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence;
each of the section of the driving substrates located in the device disposing area and the section of the driving substrate located in the bonding area further comprises a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and
the section of the driving substrate located in the bending area is configured to be capable to bend along a bending axis;
wherein the driving substrate further comprises a sacrificial layer and a third passivation layer, the sacrificial layer is located between the base plate and the buffer layer, and the third passivation layer is located between the first conductive layer and the flexible dielectric layer.
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