US 12,278,212 B2
Reworkable inter-substrate bond structure
Peter D. Brewer, Westlake Village, CA (US); John J. Vajo, West Hills, CA (US); Sevag Terterian, Lake Balboa, CA (US); Chia-Ming Chang, Agoura Hills, CA (US); Charbel Abijaoude, Newbury Park, CA (US); and Diego Eduardo Carrasco, Los Angeles, CA (US)
Assigned to The Boeing Company, Arlington, VA (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on May 18, 2022, as Appl. No. 17/663,857.
Prior Publication US 2023/0378126 A1, Nov. 23, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/98 (2013.01) [H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05101 (2013.01); H01L 2224/05117 (2013.01); H01L 2224/05123 (2013.01); H01L 2224/05138 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/0517 (2013.01); H01L 2224/05172 (2013.01); H01L 2224/05179 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05565 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/8012 (2013.01); H01L 2224/80203 (2013.01); H01L 2924/01003 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01073 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inter-substrate bond structure comprising:
an adhesion layer configured to attach the inter-substrate bond structure to a first substrate;
an outer gas-permeable layer coupled to the adhesion layer, wherein the outer gas-permeable layer is configured to expand and create a fracture in the inter-substrate bond structure in response to an absorption of a gas; and
an outer bond layer coupled to the outer gas-permeable layer, wherein the outer bond layer is configured to form an initial thermocompression bond with a mating layer on a second substrate in response to an applied pressure and an applied heat,
wherein the initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure, and the fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.