US 12,278,208 B2
Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer
Mao-Yen Chang, Kaohsiung (TW); Chih-Wei Lin, Hsinchu County (TW); Hao-Yi Tsai, Hsinchu (TW); Kuo-Lung Pan, Hsinchu (TW); Chun-Cheng Lin, New Taipei (TW); Tin-Hao Kuo, Hsinchu (TW); Yu-Chia Lai, Miaoli County (TW); and Chih-Hsuan Tai, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 1, 2023, as Appl. No. 18/499,242.
Application 18/499,242 is a continuation of application No. 17/857,035, filed on Jul. 3, 2022, granted, now 11,848,300.
Application 17/857,035 is a continuation of application No. 17/017,622, filed on Sep. 10, 2020, granted, now 11,424,213, issued on Aug. 23, 2022.
Prior Publication US 2024/0071981 A1, Feb. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 24/73 (2013.01) [H01L 21/568 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/17179 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/92125 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a semiconductor wafer;
bonding a plurality of first surface mount components and a plurality of second surface mount components onto the semiconductor wafer, wherein a first portion of each of the plurality of second surface mount components is overhanging a periphery of the semiconductor wafer;
forming a first barrier structure in between the plurality of second surface mount components and the semiconductor wafer; and
forming an underfill structure under a second portion of each of the plurality of second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.