US 12,278,206 B2
Semiconductor package with conductive adhesive that overflows for return path reduction and associated method
Chun-Wei Chen, Hsinchu County (TW); Yan-Bin Luo, Taipei (TW); and Ming-Yin Ko, Hsinchu County (TW)
Assigned to Airoha Technology (HK) Limited, North Point (HK)
Filed by Airoha Technology (HK) Limited, North Point (HK)
Filed on Jun. 6, 2022, as Appl. No. 17/832,721.
Claims priority of provisional application 63/303,914, filed on Jan. 27, 2022.
Prior Publication US 2023/0238349 A1, Jul. 27, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/32 (2013.01) [H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/1204 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a printed circuit board (PCB), having a top surface with at least one ground area formed thereon;
a semiconductor device, having a bottom surface with at least one first first-type contact formed thereon;
an interposer, located between the semiconductor device and the PCB;
a conductive adhesive, wherein the bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive, and the conductive adhesive overflows from an edge of the top surface of the interposer to have contact with said at least one ground area on the top surface of the PCB.