US 12,278,197 B2
Package board
Kenji Nishiyama, Nagaokakyo (JP); Koshi Himeda, Nagaokakyo (JP); and Yoshimitsu Ushimi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 12, 2022, as Appl. No. 17/718,725.
Claims priority of application No. 2021-071311 (JP), filed on Apr. 20, 2021.
Prior Publication US 2022/0336381 A1, Oct. 20, 2022
Int. Cl. H01L 23/64 (2006.01); H01L 23/498 (2006.01); H01L 49/02 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A package board comprising:
an inductor layer comprising:
a first magnetic layer comprising a first magnetic particle and a resin;
an inductor wiring that functions as an inductor in the first magnetic layer; and
a second magnetic layer on at least one surface of the first magnetic layer, the second magnetic layer comprising a second magnetic particle that is higher in average flatness than the first magnetic particle and a resin, and the second magnetic particle having a shape where a dimension in a direction along a main surface of the second magnetic layer is longer than a dimension in a thickness direction of the second magnetic layer,
wherein a thickness ratio ([H/(H+K)]×100 (%)) is 30% to 50%, where H is a thickness of the second magnetic layer, and K is a thickness of the first magnetic layer between the inductor wiring and the second magnetic layer.