| CPC H01L 23/5381 (2013.01) [H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 21/4853 (2013.01)] | 15 Claims |
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1. A method for manufacturing an electronic package, comprising:
providing a circuit board and at least one circuit block at a distance from one another on a carrier board, wherein the circuit block is used for transmitting power, and the circuit board is formed with a plurality of grooves forming a cross-shaped groove structure;
forming an encapsulating layer on the carrier board for encapsulating the circuit board and the circuit block, wherein the encapsulating layer has a first surface and a second surface opposite to each other, and the encapsulating layer is bonded onto the carrier board via the second surface;
disposing at least one electronic component upon the circuit block, the at least one electronic component being electrically connected with the circuit block;
removing the carrier board; and
forming a second circuit structure on the second surface of the encapsulating layer, the second circuit structure being electrically connected with the circuit board and the circuit block.
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