CPC H01L 23/5286 (2013.01) [H01L 23/50 (2013.01); H01L 23/528 (2013.01); H01L 23/5386 (2013.01); H01L 24/94 (2013.01); H10D 88/00 (2025.01)] | 20 Claims |
1. A method of forming an integrated circuit (IC) package, the method comprising:
constructing a first power distribution mesh structure on a first die included in the IC package, thereby electrically connecting the first power distribution mesh structure to a second power distribution mesh structure positioned on a back side of the first die; and
bonding a third power distribution mesh structure to the first power distribution mesh structure, the third power distribution mesh structure being positioned on a back side of a second die, thereby forming a continuous mesh structure comprising the first through third power distribution mesh structures.
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