US 12,278,185 B2
Power distribution method
Shih-Wei Peng, Hsinchu (TW); Te-Hsin Chiu, Hsinchu (TW); and Jiann-Tyng Tzeng, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 10, 2023, as Appl. No. 18/448,148.
Application 18/448,148 is a division of application No. 17/178,029, filed on Feb. 17, 2021.
Claims priority of provisional application 63/018,028, filed on Apr. 30, 2020.
Prior Publication US 2023/0411300 A1, Dec. 21, 2023
Int. Cl. H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01); H01L 27/06 (2006.01); H10D 88/00 (2025.01)
CPC H01L 23/5286 (2013.01) [H01L 23/50 (2013.01); H01L 23/528 (2013.01); H01L 23/5386 (2013.01); H01L 24/94 (2013.01); H10D 88/00 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming an integrated circuit (IC) package, the method comprising:
constructing a first power distribution mesh structure on a first die included in the IC package, thereby electrically connecting the first power distribution mesh structure to a second power distribution mesh structure positioned on a back side of the first die; and
bonding a third power distribution mesh structure to the first power distribution mesh structure, the third power distribution mesh structure being positioned on a back side of a second die, thereby forming a continuous mesh structure comprising the first through third power distribution mesh structures.