| CPC H01L 23/50 (2013.01) [G05F 1/66 (2013.01); G06F 30/20 (2020.01); G06F 30/39 (2020.01); H01L 23/5286 (2013.01)] | 21 Claims | 

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               1. An integrated circuit package comprising: 
            a die; 
                a package substrate; 
                first conductive connections coupled between the die and a first side of the package substrate; 
                second conductive connections located on a second side of the package substrate opposite from the first side, the second conductive connections coupled to the first conductive connections through conductive paths in the package substrate, wherein the first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package, and the electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections; and 
                a voltage regulator module coupled to the second conductive connections through a circuit board, wherein the voltage regulator module is part of a power delivery network, wherein the power delivery network is associated with at least one of an S-parameter of the voltage regulator module and an S-parameter of the circuit board. 
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