US 12,278,173 B2
Electronic package and substrate structure thereof
Wen-Chen Hsieh, Taichung (TW); Ya-Ting Chi, Taichung (TW); Chia-Wen Tsao, Taichung (TW); Hsin-Yin Chang, Taichung (TW); Yi-Lin Tsai, Taichung (TW); and Hsiu-Fang Chien, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jul. 7, 2022, as Appl. No. 17/859,291.
Claims priority of application No. 111115837 (TW), filed on Apr. 26, 2022.
Prior Publication US 2023/0343692 A1, Oct. 26, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/3135 (2013.01); H01L 23/49811 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate structure, comprising:
a substrate body defined with an encapsulation area and a peripheral area adjacent to each other on a surface of the substrate body; and
at least one functional circuit formed on the substrate body and extending from the encapsulation area to the peripheral area, wherein the functional circuit is defined with a first block located on the encapsulation area, a second block located on the peripheral area, and at least one wire connecting the first block and the second block, and wherein the wire has a width less than a width of the first block.