US 12,278,170 B2
Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical component
Hiroshi Ishino, Nisshin (JP); Hirokazu Sampei, Nisshin (JP); Katsuya Kumagai, Nisshin (JP); and Koji Doi, Nisshin (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed on Jun. 22, 2022, as Appl. No. 17/846,371.
Claims priority of application No. 2021-104329 (JP), filed on Jun. 23, 2021.
Prior Publication US 2022/0415765 A1, Dec. 29, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/49575 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49548 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a resin molded part encapsulating a semiconductor chip;
a first terminal having a plate shape; and
a second terminal having a plate shape, wherein
the first terminal and the second terminal are disposed to overlap with each other in a thickness direction of the first terminal and the second terminal,
the first terminal is exposed from a first surface of the resin molded part, and
the second terminal is projected from a second surface of the resin molded part to an outside of the resin molded part, the second surface being different from the first surface from which the first terminal is exposed.