US 12,278,163 B2
Power semiconductor module with injection-molded or laminated cooler assembly
Niko Pavlicek, Zürich (CH); Lluis Santolaria, Olten (CH); Dominik Truessel, Bremgarten (CH); and Helder Mata, Baden (CH)
Assigned to Hitachi Energy Ltd, Zürich (CH)
Filed by Hitachi Energy Ltd, Zürich (CH)
Filed on Feb. 25, 2022, as Appl. No. 17/681,136.
Claims priority of application No. 21163707 (EP), filed on Mar. 19, 2021.
Prior Publication US 2022/0301979 A1, Sep. 22, 2022
Int. Cl. H01L 23/46 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 21/4817 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 23/3142 (2013.01); H05K 7/20927 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling assembly comprising:
a first cooler part having an opening and an attachment point arranged on a first side of the first cooler part, wherein the opening is configured to receive an integrated cooling structure of a corresponding semiconductor module that includes a metal baseplate to be attached to the attachment point on the first side of the first cooler part, the first cooler part and the metal baseplate being attached without an O-ring; and
a second cooler part arranged on an opposite, second side of the first cooler part, wherein the first cooler part and the second cooler part are made from a fiber reinforced polymer material and are joined to form a cavity for a coolant between the second side of the first cooler part and the second cooler part.