US 12,278,162 B2
Coplanar control for film-type thermal interface
Yu-Hsun Wang, Zhubei (TW); Ping-Yin Hsieh, Hsinchu (TW); Pu Wang, Hsinchu (TW); Li-Hui Cheng, New Taipei (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 7, 2023, as Appl. No. 18/366,481.
Application 18/366,481 is a division of application No. 17/392,904, filed on Aug. 3, 2021, granted, now 11,973,005.
Claims priority of provisional application 63/184,598, filed on May 5, 2021.
Prior Publication US 2024/0014100 A1, Jan. 11, 2024
Int. Cl. H01L 23/433 (2006.01); H01L 23/367 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/433 (2013.01) [H01L 23/3675 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 23/49833 (2013.01); H01L 25/18 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a package component;
a first device die and a second device die over and bonding to the package component;
an underfill comprising:
a first portion between the first device die and the package component; and
a second portion between the second device die and the package component; and
a first adhesive feature between the first device die and the second device die, wherein the first adhesive feature contacts a sidewall of the first device die.