US 12,278,161 B1
Baffles for electronic circuits immersed in cooling fluid in a tank
Anuya Reddy, Pleasanton, CA (US); and Pranav Kalyanraman, Santa Clara, CA (US)
Assigned to Auradine, Inc., Santa Clara, CA (US)
Filed by Auradine, Inc., Santa Clara, CA (US)
Filed on Dec. 3, 2024, as Appl. No. 18/967,181.
Int. Cl. H01L 23/427 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 25/07 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01)
CPC H01L 23/427 (2013.01) [H01L 23/433 (2013.01); H01L 24/32 (2013.01); H01L 25/072 (2013.01); H05K 1/0204 (2013.01); H05K 1/144 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1433 (2013.01); H05K 2201/042 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10522 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
at least one printed circuit board (PCB) immersed in a cooling fluid in a tank, wherein the at least one PCB comprises one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate; and
at least one baffle cover positioned along an edge of the at least one PCB, the baffle cover comprising one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.