| CPC H01L 23/3732 (2013.01) [H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 3/3436 (2013.01); H05K 7/20254 (2013.01); H01L 25/0655 (2013.01); H01L 2223/58 (2013.01); H01L 2224/32 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/041 (2013.01)] | 15 Claims |
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1. A microelectronic device assembly comprising:
a substrate;
a microelectronic element electrically connected to the substrate, the microelectronic element having an active surface facing toward the substrate and a rear surface facing away from the substrate, a stiffener element overlying the substrate and extending around the microelectronic element, the stiffener element comprising a first material having a first thermal conductivity; and
a heat distribution device overlying the rear surface of the microelectronic element and a surface of the stiffener element facing toward the heat distribution device, the heat distribution device comprising a second material having a second thermal conductivity; wherein the stiffener element is joined to the substrate with a first adhesive, and the stiffener element is joined to the heat distribution device with a second adhesive, wherein the first adhesive has a first modulus of elasticity that is different than a second modulus of elasticity of the second adhesive, and
wherein the first modulus of elasticity of the first adhesive is greater than the second modulus of elasticity of the second adhesive.
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