	US 12,278,158 B2
	Leadframe spacer for double-sided power module
Tzu-Hsuan Cheng, Scarborough, ME (US); Yong Liu, Cumberland Foreside, ME (US); and Liangbiao Chen, Scarborough, ME (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Nov. 27, 2023, as Appl. No. 18/520,361.
Application 17/447,011 is a division of application No. 16/740,130, filed on Jan. 10, 2020, granted, now 11,121,055, issued on Sep. 14, 2021.
Application 18/520,361 is a continuation of application No. 17/447,011, filed on Sep. 7, 2021, granted, now 11,830,784.
Prior Publication US 2024/0096734 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/367 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H05K 7/20 (2006.01)

CPC H01L 23/3675 (2013.01) [H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/3735 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H05K 7/2089 (2013.01); H01L 23/49524 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/84801 (2013.01); H01L 2924/13055 (2013.01)]

20 Claims

1. A semiconductor device module, comprising:

a first substrate;

a leadframe spacer having a first side electrically connected to the first substrate and including at least two pedestals on a second side of the leadframe spacer that is opposite the first side;

a first semiconductor device disposed on the second side of, and electrically connected to, the leadframe spacer;

a second semiconductor device disposed on the second side of, and electrically connected to, the leadframe spacer; and

a second substrate mounted on the second side of the leadframe spacer on the at least two pedestals and at least partially enclosing the first semiconductor device and the second semiconductor device.