US 12,278,157 B2
Heat radiator and electronic component module
Tetsunori Tsumuraya, Yamato (JP)
Assigned to Molex, LLC, Lisle, IL (US)
Appl. No. 18/269,768
Filed by Molex, LLC, Lisle, IL (US)
PCT Filed Nov. 16, 2021, PCT No. PCT/IB2021/060579
§ 371(c)(1), (2) Date Jun. 27, 2023,
PCT Pub. No. WO2022/153107, PCT Pub. Date Jul. 21, 2022.
Claims priority of application No. 2021-002642 (JP), filed on Jan. 12, 2021.
Prior Publication US 2024/0321671 A1, Sep. 26, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 23/373 (2006.01)
CPC H01L 23/3672 (2013.01) [H01L 23/3735 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A heat radiator, comprising:
a thermally conductive plate with a surface; and
a resin coating integrated with the thermally conductive plate configured to cover at least a portion of the surface of the thermally conductive plate,
wherein the resin coating includes a ventilation cylinder through which ventilation holes passing through the thermally conductive plate and the resin coating, and wherein at least a portion of the thermally conductive plate is housed inside a cylindrical wall of the ventilation cylinder and extends upward from the surface of the thermally conductive plate.