	US 12,278,154 B2
	Semiconductor device and a method of manufacturing a semiconductor device
Se Man Oh, Seoul (KR); Kyoung Yeon Lee, Incheon (KR); Sang Hyeon Lee, Incheon (KR); and Min Cheol Shin, Gyeonggi-Do (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Apr. 26, 2023, as Appl. No. 18/139,872.
Application 18/139,872 is a continuation of application No. 17/081,029, filed on Oct. 27, 2020, granted, now 11,664,289.
Application 17/081,029 is a continuation of application No. 16/209,585, filed on Dec. 4, 2018, granted, now 10,818,569.
Prior Publication US 2023/0260863 A1, Aug. 17, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01)

CPC H01L 23/3128 (2013.01) [H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/42 (2013.01); H01L 23/481 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01)]

19 Claims

1. A method of manufacturing a semiconductor device, comprising:

providing a substrate comprising a conductive structure;

providing a first electronic device on a top side of the substrate and coupled with the conductive structure;

providing a second electronic device on the top side of the substrate and coupled with the conductive structure;

providing an encapsulant on the top side of the substrate and between the first electronic device and the second electronic device;

providing an array of covers over the first electronic device and the second electronic device, wherein a first cover of the array of covers is over the first electronic device and a second cover of the array of covers is over the second electronic device, and wherein the array of covers includes a casing structure surrounding a periphery of each of the first cover and the second cover; and

singulating the substrate between the first electronic device and the second electronic device.