US 12,278,135 B2
Substrate treating apparatus
Hirofumi Tonai, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., (JP)
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
Filed on Nov. 12, 2021, as Appl. No. 17/524,798.
Claims priority of application No. 2020-198317 (JP), filed on Nov. 30, 2020.
Prior Publication US 2022/0172979 A1, Jun. 2, 2022
Int. Cl. H01L 21/687 (2006.01)
CPC H01L 21/68764 (2013.01) [H01L 21/68728 (2013.01); H01L 21/68757 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A substrate treating apparatus for performing a predetermined treatment on a substrate, the apparatus comprising:
a spin table configured to be rotatable around a vertical axis;
a rotational driving device having a grounded rotary shaft connected to a center portion of the spin table and configured to rotate the spin table in a horizontal plane;
a holding mechanism having a plurality of support pins, provided on a top face of the spin table adjacent to an outer circumference and made of a conductive material, and configured to hold a substrate in a horizontal posture while the substrate is spaced apart from the top face of the spin table; and
a ground line having conductivity, constituting a part of the spin table, and electrically connecting the plurality of support pins and the rotary shaft; wherein
the spin table includes a groove formed therein with a major axis from each of the support pins to the rotary shaft individually,
the groove has a trapezoidal shape whose upper side is formed longer than a lower side thereof in a longitudinal cross section along a minor axis orthogonal to the major axis, and
the ground line has a longitudinal cross section along the minor axis that corresponds to the groove.