US 12,278,133 B2
Substrate transferring unit, substrate processing apparatus, and substrate processing method
Sangjine Park, Suwon-si (KR); Kuntack Lee, Suwon-si (KR); Jihwan Park, Hwaseong-si (KR); and Seungmin Shin, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Dec. 19, 2023, as Appl. No. 18/545,644.
Application 18/545,644 is a division of application No. 17/735,723, filed on May 3, 2022, granted, now 11,881,426.
Claims priority of application No. 10-2021-0115806 (KR), filed on Aug. 31, 2021.
Prior Publication US 2024/0120232 A1, Apr. 11, 2024
Int. Cl. H01L 21/687 (2006.01); G03F 7/40 (2006.01); G03F 7/20 (2006.01)
CPC H01L 21/68707 (2013.01) [G03F 7/40 (2013.01); G03F 7/2004 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A substrate transferring unit comprising:
a first blade configured to transfer a substrate that is in a dry state;
a second blade provided below the first blade and configured to transfer the substrate that is in a wet state;
a first cover provided above the first blade;
a second cover provided between the first blade and the second blade; and
a carrier configured to temporarily store the substrate that is in the dry state,
wherein the carrier comprises:
a cassette accommodating a plurality of substrates; and
a purge nozzle through which gas is injected into the cassette.