US 12,278,131 B2
Stage and plasma processing apparatus
Naoki Sugawa, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jan. 7, 2021, as Appl. No. 17/143,399.
Claims priority of application No. 2020-001714 (JP), filed on Jan. 8, 2020.
Prior Publication US 2021/0210369 A1, Jul. 8, 2021
Int. Cl. H01L 21/683 (2006.01); H01J 37/20 (2006.01); H01J 37/305 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/683 (2013.01) [H01J 37/20 (2013.01); H01J 37/305 (2013.01); H01L 21/67069 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A stage, comprising:
a first mount having an upper surface on which a substrate is mounted;
a second mount on which an edge ring surrounding a peripheral edge of the substrate is mounted, the second mount located lower than the first mount;
a first bonding layer configured to bond a first base to the first mount;
a second bonding layer configured to bond a second base to the second mount; and
a sealer having elasticity and configured to close a space between the first mount and the second mount by deformation of the sealer above the first bonding layer and the second bonding layer while contacting with each of the first mount and the second mount,
wherein an upper end of the sealer is positioned lower than the upper surface of the first mount,
wherein the sealer has an inner peripheral surface including:
a protruding portion configured to contact with a surface of the first mount;
a first portion configured to be elastically deformed to make contact with a surface of the first base; and
a second portion located between the protruding portion and the first portion, and configured not to contact with the first mount and the first base, and
wherein an outer peripheral surface of the sealer is in contact with an upper portion of an inner peripheral surface of the second mount only in a region below the protruding portion and the first portion.