| CPC H01L 21/67742 (2013.01) [H01L 21/67023 (2013.01); H01L 21/67034 (2013.01); H01L 21/67326 (2013.01); H01L 21/67745 (2013.01)] | 10 Claims |
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1. An apparatus for treating a substrate, the apparatus comprising:
a first process chamber configured to perform a liquid treatment process on the substrate;
a second process chamber configured to perform a drying treatment process on the substrate liquid-treated in the first process chamber;
a substrate transfer robot including:
a first hand configured to introduce the substrate to the first process chamber, before the liquid treatment process is performed,
a second hand configured to withdraw the substrate from the first process chamber after the liquid treatment process is performed and to introduce the substrate into the second process chamber,
a third hand configured to withdraw the substrate from the second process chamber after the drying treatment process is performed, and
a body to which the first hand, the second hand, and the third hand are provided; and
a controller configured to control individually driving each of the first hand, the second hand, and the third hand in a forward horizontal direction or in a backward horizontal direction extending along a horizontal straight line relative to an upper surface of the body,
wherein the third hand, the first hand, and the second hand are disposed at different heights in a vertical direction on the body,
wherein the first hand is disposed below the third hand,
wherein the first hand and the third hand are disposed above the second hand which withdraws the substrate from the first process chamber after the liquid treatment process is performed, and
wherein the controller is configured to:
control the first hand to transfer the substrate before the liquid treatment process is performed,
control the second hand to transfer the substrate having a surface coated with a wetting solution in the liquid treatment process,
control the third hand to transfer the substrate which is dried, and
control the second hand to transfer the substrate at a lower speed than a speed of transferring the substrate by the first hand or the third hand.
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