US 12,278,124 B2
Model-based controlled load lock pumping scheme
D. Jeffrey Lischer, Acton, MA (US); Bon-Woong Koo, Andover, MA (US); Dawei Sun, Lynnfield, MA (US); Chi-Yang Cheng, West Lebanon, NH (US); Paul Joseph Murphy, Reading, MA (US); Frank Sinclair, Boston, MA (US); Gregory Edward Stratoti, Sandown, NH (US); Tseh-Jen Hsieh, Rowley, MA (US); Wayne Chen, Brookline, MA (US); and Guy Oteri, Merrimac, MA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 28, 2021, as Appl. No. 17/513,241.
Prior Publication US 2023/0138326 A1, May 4, 2023
Int. Cl. H01L 21/67 (2006.01); G05D 22/02 (2006.01)
CPC H01L 21/67201 (2013.01) [G05D 22/02 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A system for introducing workpieces to a semiconductor processing tool, comprising:
a load lock;
a vacuum pump;
a valve between the load lock and the vacuum pump; and
a controller, comprising a memory element storing a plurality of profiles, each profile associated with a respective relative humidity; wherein an operating relative humidity is supplied to the controller, the controller selects one of the plurality of profiles based on the operating relative humidity, referred to as a selected profile; and controls the valve based on the selected profile;
wherein the profile is created using a computer model and the computer model is created so as to maintain a supersaturation ratio within the load lock at or below a supersaturation ratio threshold, which is less than or equal to a critical value at which vapor condenses.