US 12,278,122 B2
Heating device and heating method
Takashi Sugimoto, Yamanashi (JP); Hiroyuki Takahashi, Yamanashi (JP); and Shinya Okano, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Sep. 17, 2021, as Appl. No. 17/478,492.
Claims priority of application No. 2020-159644 (JP), filed on Sep. 24, 2020.
Prior Publication US 2022/0093422 A1, Mar. 24, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/268 (2006.01); H05B 1/02 (2006.01); H05B 3/00 (2006.01)
CPC H01L 21/67115 (2013.01) [H01L 21/2686 (2013.01); H05B 1/0233 (2013.01); H05B 3/0047 (2013.01); H05B 2203/005 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A heating device for heating a substrate, comprising:
a support portion configured to support the substrate;
a light irradiation unit configured to heat the substrate by irradiating the substrate supported by the support portion with light;
an optical window provided between the support portion and the light irradiation unit;
a heat insulating plate configured to suppress a temperature drop of a portion, which is not subject to the heating by the light irradiation unit, of the substrate supported by the support portion; and
a rotation mechanism configured to rotate the heat insulating plate,
wherein a plurality of zones are set in the light irradiation unit, and each of the plurality of zones set in the light irradiation unit irradiates different portions of a surface of the substrate supported by the support portion with light,
during the heating by the light irradiation unit, the plurality of zones take turns so that some zones of the plurality of zones are utilized, and
the heat insulating plate is provided at a position between the substrate supported by the support portion and the light irradiation unit and between the support portion and the optical window, and includes an opening through which the light passes.