US 12,278,121 B2
Support unit, substrate treating apparatus including the same, and substrate treating method
Kangseop Yun, Cheonan-si (KR); Seung Hoon Oh, Cheonan-si (KR); Ye Jin Choi, Seoul (KR); Youngil Lee, Cheonan-si (KR); Byungsun Bang, Hwaseong-si (KR); Jungbong Choi, Suwon-si (KR); and Gui Su Park, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Aug. 6, 2020, as Appl. No. 16/986,418.
Claims priority of application No. 10-2019-0099574 (KR), filed on Aug. 14, 2019.
Prior Publication US 2021/0050235 A1, Feb. 18, 2021
Int. Cl. H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67115 (2013.01) [H01L 21/67109 (2013.01); H01L 21/6719 (2013.01); H01L 21/68764 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a support unit configured to support the substrate; and
a liquid supply configured to supply a treatment liquid to the substrate supported on the support unit,
wherein the support unit includes,
a support plate on which the substrate is placed,
a heater inside the support plate and configured to heat the substrate placed on the support plate,
a heat insulating plate inside the support plate and under the heater,
a reflective plate inside the support plate and under the heater, and
a heat dissipation plate inside the support plate and under the reflective plate,
wherein the heat dissipation plate includes a fluid channel configured to flow a cooling fluid therethrough, and
wherein each of the heat insulating plate and the reflective plate vertically overlaps an entirety of the heater.