US 12,278,117 B2
Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
Taejin Choi, Yongin-si (KR); Chunggu Lee, Yongin-si (KR); Sooin Park, Yongin-si (KR); and Jungjin Lee, Yongin-si (KR)
Assigned to DOOSAN CORPORATION, Seoul (KR)
Filed by DOOSAN CORPORATION, Seoul (KR)
Filed on Feb. 9, 2024, as Appl. No. 18/438,158.
Application 18/438,158 is a division of application No. 17/404,009, filed on Aug. 17, 2021, granted, now 11,942,336.
Claims priority of application No. 10-2020-0182150 (KR), filed on Dec. 23, 2020.
Prior Publication US 2024/0186153 A1, Jun. 6, 2024
Int. Cl. H01L 21/56 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); C09J 163/00 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/563 (2013.01) [C09J 7/38 (2018.01); C09J 7/405 (2018.01); C09J 163/00 (2013.01); H01L 24/92 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); H01L 2224/92125 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing a semiconductor package, the method comprising:
(i) bonding an adhesive layer of an underfill film on a bump of a semiconductor chip provided with the bump;
(ii) picking up the bump of the semiconductor chip to which the adhesive layer is bonded, and aligning the bump on a bonding pad of a package substrate supported on a bonding stage;
(iii) putting the aligned semiconductor chip and package substrate into a pressure chamber oven;
(iv) melting the bump of the semiconductor chip to connect the semiconductor chip and the package substrate; and
(v) curing the adhesive layer disposed between the connected semiconductor chip and package substrate,
wherein the
adhesive layer has a melt viscosity in a range of 300 to 1000 Pa·s at 150 to 160° C., and has an onset temperature of 145±5° C. on a differential scanning calorimeter (DSC), and
the adhesive layer is a cured product or a semi-cured product of an adhesive resin composition, said adhesive resin composition comprising:
(a) at least three or more epoxy resin containing a liquid epoxy resin, a phenoxy resin, and a polyfunctional epoxy resin;
(b) an acid anhydride curing agent;
(c) a nitrogen (N)-containing heterocyclic compound; and
(d) a filler; and
wherein a mixing ratio of the polyfunctional epoxy resin, the phenoxy resin, and the liquid epoxy resin is 4:3 to 4:2 to 3 by weight.