US 12,278,116 B2
Chip cooler with high pressure bearing capacity
Dingjun Dai, Zhejiang (CN); Hongqiang Zhuo, Zhejiang (CN); Xuguang Sun, Zhejiang (CN); Aibin Yan, Zhejiang (CN); and Tinghui Chen, Zhejiang (CN)
Assigned to NINGBO HALLEY HEAT EXCHANGE EQUIPMENT CO., LTD, Zhejiang (CN)
Appl. No. 17/755,626
Filed by NINGBO HALLEY HEAT EXCHANGE EQUIPMENT CO., LTD, Zhejiang (CN)
PCT Filed Jun. 4, 2021, PCT No. PCT/CN2021/098331
§ 371(c)(1), (2) Date May 3, 2022,
PCT Pub. No. WO2022/007563, PCT Pub. Date Jan. 13, 2022.
Claims priority of application No. 202021345114.7 (CN), filed on Jul. 9, 2020.
Prior Publication US 2022/0392776 A1, Dec. 8, 2022
Int. Cl. H01L 21/48 (2006.01); G12B 15/00 (2006.01); H01L 23/473 (2006.01)
CPC H01L 21/4871 (2013.01) [G12B 15/00 (2013.01); H01L 23/473 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A chip cooler, comprising: a cooler body having an upper heat-conducting plate and a lower heat-conducting plate,
wherein the upper heat-conducting plate comprises a groove facing the lower heat-conducting plate so as to cooperatively form with the lower heat-conducting plate a refrigerant channel in an interior of the cooler body and configured to guide the flow of a refrigerant, and a liquid inlet channel and a liquid outlet channel at an edge of the cooler body,
wherein a reinforced connecting piece is disposed in at least one of the liquid inlet channel and the liquid outlet channel, the reinforced connecting piece being a cross-shaped structure or a custom character-shaped structure, and
wherein the reinforced connecting piece is in contact with the upper heat-conducting plate and the lower heat-conducting plate that form the upper wall and the lower wall, respectively, of the liquid inlet channel and the liquid outlet channel.