US 12,278,096 B2
Shield cooling assembly, reaction chamber and semiconductor processing apparatus
Qing Chang, Beijing (CN); Bing Li, Beijing (CN); and Guodong Bian, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Filed on Jul. 23, 2021, as Appl. No. 17/384,240.
Application 17/384,240 is a continuation of application No. PCT/CN2020/072184, filed on Jan. 15, 2020.
Claims priority of application No. 201910062064.7 (CN), filed on Jan. 23, 2019; and application No. 201920110253.2 (CN), filed on Jan. 23, 2019.
Prior Publication US 2021/0351016 A1, Nov. 11, 2021
Int. Cl. H01J 37/34 (2006.01); C23C 14/35 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01)
CPC H01J 37/3441 (2013.01) [C23C 14/35 (2013.01); C23C 16/4585 (2013.01); H01J 37/32522 (2013.01); H01J 37/32651 (2013.01); H01J 37/3405 (2013.01); H01J 2237/002 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A shield cooling assembly, comprising:
an adapter configured to fix a shield in a chamber, the adapter including a first surface, a second surface, a fixing part, a cylindrical main body surrounding the shield, and a supporting part connected to the cylindrical main body for supporting a bottom wall of the shield, the fixing part, the cylindrical main body, and the supporting part forming an integral structure,
wherein:
an inner side surface of the cylindrical main body serves as the first surface;
a surface of the supporting part that is in contact with a bottom surface of the bottom wall of the shield serves as the second surface;
the first surface and the second surface face an outer side surface of the shield and the bottom surface of the bottom wall of the shield;
a predetermined gap is provided between the first surface and the outer side surface of the shield;
the second surface is in contact with the bottom surface of the bottom wall of the shield;
the adapter is provided with a cooling channel for transmitting a cooling medium to cool the shield;
the cooling channel is provided inside the cylindrical main body and the supporting part;
the cooling channel includes a first channel disposed inside the cylindrical main body;
an annular blocking member is provided at the bottom of the cylindrical main body, and is hermetically connected to the cylindrical main body to seal the first channel;
the shield contacts the fixing part; and
the fixing part is arranged between a side wall of the chamber and an insulating member located above the side wall to form a closed space to enclose the shield, the first surface, and the second surface in the chamber.