CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/2325 (2013.01); H01G 4/12 (2013.01)] | 16 Claims |
1. A multilayer electronic component comprising:
a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including a plurality of dielectric layers and a plurality of internal electrodes interposed between the plurality of dielectric layers and extending from the third and fourth surfaces; and
an external electrode disposed on the body to be connected to the plurality of internal electrodes,
wherein the external electrode includes:
a first plating layer covering the third surface;
a second plating layer covering the fourth surface;
a first electrode layer covering first portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer;
a second electrode layer covering second portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer;
a third plating layer covering the first plating layer, where a surface of the first electrode layer facing away from the first surface is not covered by the third plating layer; and
a fourth plating layer covering the second plating layer.
|