US 12,278,056 B2
Multilayer electronic component
So Jung An, Suwon-si (KR); Yoo Jeong Lee, Suwon-si (KR); Hyung Jong Choi, Suwon-si (KR); Chung Yeol Lee, Suwon-si (KR); Kwang Yeun Won, Suwon-si (KR); Woo Kyung Sung, Suwon-si (KR); Myung Jun Park, Suwon-si (KR); and Jong Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 20, 2022, as Appl. No. 18/085,037.
Claims priority of application No. 10-2022-0018035 (KR), filed on Feb. 11, 2022.
Prior Publication US 2023/0260708 A1, Aug. 17, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/2325 (2013.01); H01G 4/12 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including a plurality of dielectric layers and a plurality of internal electrodes interposed between the plurality of dielectric layers and extending from the third and fourth surfaces; and
an external electrode disposed on the body to be connected to the plurality of internal electrodes,
wherein the external electrode includes:
a first plating layer covering the third surface;
a second plating layer covering the fourth surface;
a first electrode layer covering first portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer;
a second electrode layer covering second portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer;
a third plating layer covering the first plating layer, where a surface of the first electrode layer facing away from the first surface is not covered by the third plating layer; and
a fourth plating layer covering the second plating layer.