US 12,278,053 B2
Ceramic electronic component
Jin Woo Kim, Suwon-si (KR); Chang Hak Choi, Suwon-si (KR); Seok Hyun Yoon, Suwon-si (KR); Ki Yong Lee, Suwon-si (KR); and Jong Myeong Jeon, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Dec. 6, 2023, as Appl. No. 18/531,057.
Application 18/531,057 is a continuation of application No. 17/740,769, filed on May 10, 2022, granted, now 11,887,786.
Claims priority of application No. 10-2021-0076761 (KR), filed on Jun. 14, 2021.
Prior Publication US 2024/0128022 A1, Apr. 18, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A ceramic electronic component, comprising:
a body including a dielectric layer and an internal electrode; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains,
wherein the grain boundary includes Sn, a rare-earth element, and a first subcomponent,
wherein the first subcomponent includes at least one of Si, Mg, and Al.