CPC H01G 4/1227 (2013.01) [H01G 4/012 (2013.01); H01G 4/30 (2013.01)] | 20 Claims |
1. A multilayer electronic component comprising:
a body including a dielectric layer including dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction; and
external electrodes disposed on the body,
wherein at least one of the dielectric grains has a core-shell structure including an inner core and a shell covering at least a portion of the inner core,
a ratio of an average size of the inner core to an average size of the at least one dielectric grain having the core-shell structure is 0.4 or more and 0.8 or less,
a ratio ((Dy+Tb)/Sn) of a sum of a number of moles of dysprosium (Dy) and a number of moles of terbium (Tb) to a number of moles of tin (Sn) included in the dielectric layer satisfies 0.7 or more and 1.5 or less, and
the dielectric layer has four or more of the dielectric grains in the first direction.
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