US 12,278,052 B2
Multilayer electronic component
Hee Sun Chun, Suwon-si (KR); Jin Woo Kim, Suwon-si (KR); Tae Hyung Kim, Suwon-si (KR); Hyo Ju Lee, Suwon-si (KR); Seok Hyun Yoon, Suwon-si (KR); and Jeong Ryeol Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 17, 2023, as Appl. No. 18/123,027.
Claims priority of application No. 10-2022-0176005 (KR), filed on Dec. 15, 2022.
Prior Publication US 2024/0203649 A1, Jun. 20, 2024
Int. Cl. H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer including dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction; and
external electrodes disposed on the body,
wherein at least one of the dielectric grains has a core-shell structure including an inner core and a shell covering at least a portion of the inner core,
a ratio of an average size of the inner core to an average size of the at least one dielectric grain having the core-shell structure is 0.4 or more and 0.8 or less,
a ratio ((Dy+Tb)/Sn) of a sum of a number of moles of dysprosium (Dy) and a number of moles of terbium (Tb) to a number of moles of tin (Sn) included in the dielectric layer satisfies 0.7 or more and 1.5 or less, and
the dielectric layer has four or more of the dielectric grains in the first direction.