US 12,278,043 B2
Electronic apparatus and method of manufacturing electronic device
Hugues Njiende, Paderborn (DE); Eugen Schwan, Schwerte (DE); and Sergey Tikhonov, Bad Sassendorf (DE)
Assigned to Delta Electronics (Thailand) Public Co., Ltd., Samutprakarn (TH)
Filed by Delta Electronics (Thailand) Public Co., Ltd., Samutprakarn (TH)
Filed on Oct. 21, 2022, as Appl. No. 18/048,450.
Claims priority of application No. 21203991 (EP), filed on Oct. 21, 2021.
Prior Publication US 2023/0125969 A1, Apr. 27, 2023
Int. Cl. H01F 41/00 (2006.01); H01F 27/02 (2006.01); H01F 27/08 (2006.01)
CPC H01F 41/005 (2013.01) [H01F 27/022 (2013.01); H01F 27/08 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic device, wherein the electronic device comprises at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, wherein the method comprises:
inserting the at least one electronic component into a cavity;
pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; and
removing the electronic device from the cavity;
wherein the electronic device comprises a heat dissipation element, wherein the method comprises: positioning the heat dissipation element in or at the cavity before pouring, and attaching the electronic component to the heat dissipation element by curing the heat dissipation mass coating.