US 12,278,034 B2
Coil device
Chen Wang, Tokyo (JP); and Satoshi Sugimoto, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on May 26, 2021, as Appl. No. 17/330,694.
Claims priority of application No. 2020-093499 (JP), filed on May 28, 2020.
Prior Publication US 2021/0375519 A1, Dec. 2, 2021
Int. Cl. H01F 27/29 (2006.01); H01F 17/04 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01)
CPC H01F 17/04 (2013.01) [H01F 27/24 (2013.01); H01F 27/2847 (2013.01); H01F 2017/048 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A coil device comprising:
a core;
a coil at least partly disposed close to the core;
a mounting part for being mounted on an installation surface; and
a bottom raising part connected with the coil and extending to the mounting part so as to form a gap having a predetermined height between a lower surface of the mounting part and a bottom surface of the core, wherein
a length of the mounting part extending in a direction away from the core is larger than the predetermined height,
the core includes a main core and a sub core disposed on an upper surface of the main core,
a side groove is formed on a side surface of the main core so that a side surface of the coil does not protrude from the side surface of the main core, and
a bottom groove connected to the side groove is formed on a bottom surface of the main core.