US 12,278,029 B2
Heat dissipating structures
Yudi Setiawan, Singapore (SG); Handoko Linewih, Singapore (SG); and Siow Lee Chwa, Singapore (SG)
Assigned to GLOBALFOUNDRIES Singapore Pte. Ltd, Singapore (SG)
Filed by GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore (SG)
Filed on Dec. 17, 2021, as Appl. No. 17/554,337.
Prior Publication US 2023/0197320 A1, Jun. 22, 2023
Int. Cl. H01C 1/08 (2006.01); H01C 1/084 (2006.01); H01C 7/00 (2006.01); H01C 17/075 (2006.01)
CPC H01C 1/08 (2013.01) [H01C 1/084 (2013.01); H01C 7/006 (2013.01); H01C 17/075 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A structure comprising:
a thin film resistor within a back end of a line structure; and
a heat dissipating structure below the thin film resistor comprising a top plate with a slotted configuration, and within the back end of the line structure, and a solid bottommost plate disposed within an insulator material of the back end of the line structure,
wherein the top plate with the slotted configuration comprises slots filled with the insulator material and is connected to an upper wiring structure from a top side by via connections on a side extending beyond an end of the thin film resistor, and
wherein the top plate extends beyond a footprint of the thin film resistor, and via connections extend to and contact the top plate beyond the footprint of the thin film resistor, and the via connections are provided on a side of the slotted configuration of the top plate and the thin film resistor is on another side of the slotted configuration and the solid bottommost plate extends beyond the slotted configuration.