US 12,278,025 B2
Insulated copper wire and electric coil
Makoto Urushihara, Hitachinaka (JP); and Hideaki Sakurai, Naka-gun (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/441,474
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Feb. 17, 2020, PCT No. PCT/JP2020/006014
§ 371(c)(1), (2) Date Sep. 21, 2021,
PCT Pub. No. WO2020/195319, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-061635 (JP), filed on Mar. 27, 2019.
Prior Publication US 2022/0148757 A1, May 12, 2022
Int. Cl. H01B 7/02 (2006.01); B32B 15/088 (2006.01); H01B 7/00 (2006.01); H01B 13/00 (2006.01); H01B 13/16 (2006.01); H01F 5/06 (2006.01)
CPC H01B 7/0216 (2013.01) [H01B 13/0016 (2013.01); H01F 5/06 (2013.01); B32B 15/088 (2013.01); H01B 7/0009 (2013.01); H01B 13/16 (2013.01)] 5 Claims
OG exemplary drawing
 
1. An insulated copper wire comprising:
a copper wire; and
an insulating film coating a surface of the copper wire,
wherein the insulating film contains a polymer material having an amide bond, on a peeled surface formed on a surface of the insulated copper wire by peeling off the insulating film, there are more copper atoms bonded to a nitrogen atom or a carbon atom than copper atoms bonded to an oxygen atom,
an oxygen-containing layer containing 10 atom % or more of oxygen is formed in a depth direction from the peeled surface, and
a film thickness of the oxygen-containing layer is in a range of 2 nm or more and 30 nm or less.