US 12,278,022 B2
Stretchable interconnects for flexible electronic surfaces
Narahari Pujari, Waterbury, CT (US); Bawa Singh, Waterbury, CT (US); Ravi Bhatkal, Waterbury, CT (US); Siuli Sarkar, Waterbury, CT (US); and Anubhav Rustogi, Waterbury, CT (US)
Assigned to Alpha Assembly Solutions Inc., Waterbury, CT (US)
Filed by Alpha Assembly Solutions Inc., Waterbury, CT (US)
Filed on Oct. 5, 2023, as Appl. No. 18/376,896.
Application 18/376,896 is a division of application No. 17/382,980, filed on Jul. 22, 2021, granted, now 11,830,640.
Application 16/887,455 is a division of application No. 15/326,224, granted, now 10,672,531, issued on Jun. 2, 2020, previously published as PCT/GB2015/052024, filed on Jul. 14, 2015.
Application 17/382,980 is a continuation of application No. 16/887,455, filed on May 29, 2020, granted, now 11,139,089, issued on Oct. 5, 2021.
Claims priority of provisional application 62/027,303, filed on Jul. 22, 2014.
Prior Publication US 2024/0029916 A1, Jan. 25, 2024
Int. Cl. H01B 1/22 (2006.01); B22F 1/052 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 1/17 (2022.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/12 (2006.01)
CPC H01B 1/22 (2013.01) [B22F 1/052 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 1/17 (2022.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); B23K 35/3613 (2013.01); B23K 35/362 (2013.01); H05K 1/095 (2013.01); H05K 3/1216 (2013.01); H05K 3/1241 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01); H05K 1/189 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0203 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/10106 (2013.01)] 16 Claims
 
1. A method of forming an interconnection between two work pieces to be joined, the method comprising:
providing two or more work pieces to be joined;
applying a conductive paste to at least one of the two or more work pieces to be joined;
joining the two or more work pieces, wherein the conductive paste is between the two or more work pieces; and
curing the conductive paste, wherein the conductive paste comprises: silver particles dispersed in an organic medium, the organic medium comprising: a solvent; and a binder comprising one or more polyesters, wherein the polyester exhibits one or more of the following properties: a specific gravity of from about 1.0 to 1.35, a viscosity of from about 800 to about 50,000 cPs, and softening point of less than 100° C., wherein the binder further comprises at least one of an elastomer and an amino resin.