US 12,277,990 B2
Memory device and method of operating the same
Meng-Sheng Chang, Chubei (TW); and Ku-Feng Lin, New Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 29, 2024, as Appl. No. 18/677,095.
Application 18/677,095 is a continuation of application No. 17/669,628, filed on Feb. 11, 2022, granted, now 12,014,796.
Prior Publication US 2024/0312497 A1, Sep. 19, 2024
Int. Cl. G11C 7/06 (2006.01); G11C 7/10 (2006.01); G11C 8/08 (2006.01)
CPC G11C 7/1012 (2013.01) [G11C 7/06 (2013.01); G11C 7/1063 (2013.01); G11C 7/109 (2013.01); G11C 7/1096 (2013.01); G11C 8/08 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a first mux transistor and a first control transistor coupled between a sense amplifier and ground, and commonly connected at a first node;
a first shared gate transistor connecting a first bit line to the first node;
a second shared gate transistor connecting a second bit line to the first node;
a first memory cell connected to the first bit line; and
a second memory cell connected to the second bit line, wherein the first memory cell and the second memory cell share a first word line transistor gated by a first word line.