US 12,277,056 B2
Memory device interface and method
Brent Keeth, Boise, ID (US); Owen Fay, Meridian, ID (US); Chan H. Yoo, Boise, ID (US); Roy E. Greeff, Boise, ID (US); and Matthew B. Leslie, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jun. 28, 2023, as Appl. No. 18/215,474.
Application 18/215,474 is a continuation of application No. 17/356,906, filed on Jun. 24, 2021, abandoned.
Application 17/356,906 is a continuation of application No. 16/797,571, filed on Feb. 21, 2020, abandoned.
Claims priority of provisional application 62/826,422, filed on Mar. 29, 2019.
Claims priority of provisional application 62/816,731, filed on Mar. 11, 2019.
Claims priority of provisional application 62/809,281, filed on Feb. 22, 2019.
Prior Publication US 2024/0070069 A1, Feb. 29, 2024
Int. Cl. G06F 12/06 (2006.01); G06F 12/02 (2006.01); G11C 11/4093 (2006.01); G11C 29/12 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC G06F 12/0653 (2013.01) [G06F 12/0215 (2013.01); G11C 11/4093 (2013.01); G11C 29/12 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); G06F 2212/1016 (2013.01); G11C 2211/4062 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A memory apparatus, comprising:
a substrate,
a host physical interface to memory, the host physical interface including connections for at least one memory channel, the connections for the memory channel including command/address (CA) connections, data connections (DQs), and ECC data/parity connections (ECC DQs), wherein the memory channel includes at least 32 DQs and at least 4 ECC DQs; and
multiple DRAM devices supported by the substrate, the multiple memory devices connected to form at least nine sub-channels, each sub-channel including respective portions of at least two DRAM devices;
wherein memory cells of each sub-channel are independently addressable from memory cells of other sub-channels, and wherein each sub-channel includes at least two data paths, each data path associated with a respective data DQ or ECC DQ;
wherein memory cells of the respective DRAM portions are accessible by local word lines which extend only within the respective DRAM portion, and which are driven by respective sub-word line drivers, and wherein the local word lines being driven by respective sub-word line drivers within the respective DRAM portions serves to limit a number of DQs impacted by a failure of an individual sub-word line driver, and
wherein a bit width of each sub-channel, and independent operability of each DRAM portion, facilitate at least one of error detection and error correction of data in at least a single data path within a sub-channel.