US 12,276,972 B2
Wafer scheduling method and wafer scheduling apparatus for etching equipment
Jianping Wang, Hefei (CN); Chien-Hung Chen, Hefei (CN); and Jinjin Cao, Hefei (CN)
Assigned to CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
Appl. No. 17/596,238
Filed by CHANGXIN MEMORY TECHNOLOGIES, INC., Hefei (CN)
PCT Filed Jul. 13, 2021, PCT No. PCT/CN2021/106008
§ 371(c)(1), (2) Date Dec. 6, 2021,
PCT Pub. No. WO2022/252350, PCT Pub. Date Dec. 8, 2022.
Claims priority of application No. 202110609352.7 (CN), filed on Jun. 1, 2021.
Prior Publication US 2023/0059538 A1, Feb. 23, 2023
Int. Cl. G05B 19/418 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC G05B 19/41865 (2013.01) [H01L 21/677 (2013.01); G05B 2219/32086 (2013.01); H01L 21/67167 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A wafer scheduling method for an etching equipment, comprising:
obtaining a wafer processing request, wherein the wafer processing request comprises at least process information of wafers and an equipment processing parameter of the etching equipment;
responding to the wafer processing request, and determining a wafer scheduling parameter corresponding to the process information and the equipment processing parameter, based on the process information, the equipment processing parameter, and a preset wafer scheduling policy; wherein the wafer scheduling parameter is used to determine a transfer time for transferring the wafers to the etching equipment for processing; and
performing wafer scheduling processing on the wafers by using the wafer scheduling parameter; and,
wherein, the determining a wafer scheduling parameter corresponding to the process information and the equipment processing parameter, based on the process information, the equipment processing parameter, and a preset wafer scheduling policy, comprises:
determining the wafer scheduling parameter corresponding to the process information and the equipment processing parameter, based on the process information, the equipment processing parameter, and a preset wafer scheduling function;
wherein generating the wafer scheduling function comprises:
determining process information and an equipment processing parameter that are corresponding to each type of wafers, and a corresponding standard wafer scheduling parameter;
for each type of wafers, determining a simulated wafer scheduling parameter of the type of wafers, based on process information, an equipment processing parameter, an initial wafer scheduling function, and a preset buffer time, that are corresponding to the type of wafers; and adjusting various parameters of the initial wafer scheduling function based on the standard wafer scheduling parameter and the simulated wafer scheduling parameter until all simulated wafer scheduling parameters of all the types of wafers are calculated, to obtain the wafer scheduling function.