US 12,276,881 B2
Light-emitting substrate, light-emitting module and display device
Pei Qin, Beijing (CN); Yutao Hao, Beijing (CN); Hao Zhou, Beijing (CN); Donglei Li, Beijing (CN); Ying Chen, Beijing (CN); Honghao Yu, Beijing (CN); Jie Gao, Beijing (CN); Jiaxin Li, Beijing (CN); Jingran Niu, Beijing (CN); and Jinpeng Li, Beijing (CN)
Assigned to BOE MLED TECHNOLOGY CO., LTD., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 18/249,553
Filed by BOE MLED Technology Co., Ltd., Beijing (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Mar. 28, 2022, PCT No. PCT/CN2022/083513
§ 371(c)(1), (2) Date Apr. 19, 2023,
PCT Pub. No. WO2023/184122, PCT Pub. Date Oct. 5, 2023.
Prior Publication US 2024/0377677 A1, Nov. 14, 2024
Int. Cl. G02F 1/13357 (2006.01); G02F 1/1335 (2006.01); H01L 25/16 (2023.01); H10H 20/856 (2025.01)
CPC G02F 1/133603 (2013.01) [G02F 1/133605 (2013.01); G02F 1/133607 (2021.01); G02F 1/133611 (2013.01); G02F 1/133612 (2021.01); G02F 1/133614 (2021.01); H01L 25/167 (2013.01); H10H 20/856 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting substrate, comprising:
a substrate;
a plurality of light-emitting assemblies located on a side of the substrate; wherein at least one light-emitting assembly includes a light-emitting element and a light adjustment portion arranged around the light-emitting element; the light adjustment portion includes a plurality of sub-structures spaced apart from each other;
a driving circuit layer located on the side of the substrate; wherein the driving circuit layer includes a metal wiring and a conductive pad, and the conductive pad is electrically connected to the metal wiring; and
a reflective component located on a side of the driving circuit layer away from the substrate;
wherein the reflective component encloses a reflective cavity, and has a communication hole;
wherein in any two sub-structures in the light adjustment portion in any direction away from the light-emitting element, a height of a sub-structure closer to the light-emitting element is less than a height of a sub-structure farther from the light-emitting element;
the light-emitting element includes a light-emitting portion and a pin; the light-emitting portion is located in the reflective cavity, and the pin is electrically connected to the conductive pad through the communication hole; the plurality of sub-structures in the light adjustment portion are located in the reflective cavity; and
the reflective component includes:
a bottom wall with the communication hole, wherein the plurality of sub-structures in the light adjustment portion are located on the bottom wall, and the plurality of sub-structures in the light adjustment portion are attached to the bottom wall; and
side walls each having an end connected to the bottom wall and another end extending from the bottom wall in a direction away from the substrate; wherein the side walls and the bottom wall enclose the reflective cavity.