US 12,276,862 B2
Lens driving device, camera module, and optical device
Kap Jin Lee, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Jun. 29, 2022, as Appl. No. 17/809,820.
Application 17/809,820 is a continuation of application No. 16/678,056, filed on Nov. 8, 2019, granted, now 11,397,307.
Application 16/678,056 is a continuation of application No. 15/743,582, granted, now 10,502,924, issued on Dec. 10, 2019, previously published as PCT/KR2016/007420, filed on Jul. 8, 2016.
Claims priority of application No. 10-2015-0098267 (KR), filed on Jul. 10, 2015; and application No. 10-2015-0116342 (KR), filed on Aug. 18, 2015.
Prior Publication US 2022/0334346 A1, Oct. 20, 2022
Int. Cl. G02B 7/09 (2021.01); G03B 3/10 (2021.01); G03B 5/02 (2021.01); H02K 41/035 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/68 (2023.01)
CPC G02B 7/09 (2013.01) [G03B 3/10 (2013.01); G03B 5/02 (2013.01); H02K 41/0356 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/687 (2023.01); G03B 2205/0015 (2013.01); G03B 2205/0023 (2013.01); G03B 2205/0069 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module comprising:
a first substrate comprising a body portion, a terminal portion comprising a terminal, and a connection portion connecting the body portion and the terminal portion;
an image sensor disposed to be moved together with the body portion of the first substrate; and
a driving magnet and a coil configured to move the body portion of the first substrate by an electromagnetic interaction,
wherein the body portion of the first substrate comprises first and second lateral surfaces opposite to each other, and third and fourth lateral surfaces opposite to each other,
wherein the connection portion of the first substrate is connected to the first lateral surface of the body portion and the second lateral surface of the body portion,
wherein the terminal portion of the first substrate is extended from a part of the connection portion,
wherein the part of the connection portion is disposed at a position corresponding to the third lateral surface of the body portion,
wherein at least a portion of the terminal portion of the first substrate is disposed higher than the body portion of the first substrate,
wherein at least a portion of the first substrate is formed as a flexible circuit board, and
wherein at least a portion of the connection portion of the first substrate is disposed higher than the body portion of the first substrate.