US 12,276,850 B2
Fanout module integrating a photonic integrated circuit
Brett P. Wilkerson, Austin, TX (US); Raja Swaminathan, Austin, TX (US); Kong Toon Ng, Hsinchu (TW); and Rahul Agarwal, Livermore, CA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Jul. 24, 2023, as Appl. No. 18/357,376.
Application 18/357,376 is a continuation of application No. 17/361,033, filed on Jun. 28, 2021, granted, now 11,709,327.
Claims priority of provisional application 63/179,776, filed on Apr. 26, 2021.
Prior Publication US 2024/0019649 A1, Jan. 18, 2024
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01)
CPC G02B 6/4274 (2013.01) [G02B 6/425 (2013.01); G02B 6/4255 (2013.01); G02B 6/43 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a photonic integrated circuit die including a first surface having disposed thereon a photodetector and a plurality of interconnects; and
a semiconductor chip mounted above only a first portion of the first surface, wherein the photodetector is disposed on a second portion of the first surface that is outside of the first portion.