an optical emitting path, which comprises an optical emitter for emitting and emitting optics for bundling measuring beams along a first optical axis in the direction of a target object;

a receiving path, which comprises receiving optics for bundling reflected measuring beams along a second optical axis in the direction of an optical detector;

an optics mount, which completely optically isolates the emitting path and the receiving path from one another, fixes the emitting path and the receiving path, so as to define the first and second optical axes with respect to the optics mount;

a first printed circuit board which accommodates the optical emitter and the optical detector;

a second printed circuit board which accommodates control and evaluation electronics;

wherein the emitting optics and the receiving optics are designed as plastic components transmissive to the measuring beams and the reflected measuring beams, respectively; and

wherein the optics mount is configured as a plastic component opaque to the measuring beams, and

wherein an integral material bond exists between the emitting optics and the optics mount or the receiving optics and the optics mount, and

wherein at least one of the integral material bonds between the emitting optics and the optics mount or between the receiving optics and the optics mount is designed in the form of a 2-component injection molded part,

wherein the optics mount comprises recesses and connecting elements configured to accommodate the first and second printed circuit boards, and

wherein a part of the first printed circuit board is located outside of a volume enclosed by the optics mount.