US 12,276,696 B2
Defect detection using thermal laser stimulation and atomic force microscopy
Huei Hao Yap, Albuquerque, NM (US); Gavin Corcoran, Albuquerque, NM (US); Jungwon Kim, Albuquerque, NM (US); Seung Hwan Lee, Albuquerque, NM (US); Mark Gruidl, Rio Rancho, NM (US); Karthik Kalaiazhagan, Albuquerque, NM (US); and Youren Xu, El Dorado Hills, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 26, 2022, as Appl. No. 17/896,098.
Prior Publication US 2024/0069095 A1, Feb. 29, 2024
Int. Cl. G01R 31/311 (2006.01); G01Q 10/04 (2010.01); G01Q 20/02 (2010.01); G01Q 60/38 (2010.01)
CPC G01R 31/311 (2013.01) [G01Q 10/04 (2013.01); G01Q 20/02 (2013.01); G01Q 60/38 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inspection tool comprising:
an optical thermal laser simulation unit configured to direct a laser beam to a surface of a device under test;
an atomic force probe unit for scanning the surface of the device under test, the atomic force probe unit comprising a detector unit for monitoring movements of a plurality of probes; and
a processor coupled to the optical thermal laser simulation unit, the atomic force probe unit, and detector unit, wherein the processor performs a fault location analysis and generates a map for a device under test.