US 12,276,676 B2
Test carrier and carrier assembling apparatus
Toshiyuki Kiyokawa, Tokyo (JP); and Kazuya Ohtani, Tokyo (JP)
Assigned to ADVANTEST Corporation, Tokyo (JP)
Filed by ADVANTEST Corporation, Tokyo (JP)
Filed on Sep. 24, 2021, as Appl. No. 17/484,368.
Application 17/484,368 is a continuation of application No. 16/351,348, filed on Mar. 12, 2019, granted, now 11,531,043.
Claims priority of application No. 2018-091984 (JP), filed on May 11, 2018.
Prior Publication US 2022/0011341 A1, Jan. 13, 2022
Int. Cl. G01R 1/04 (2006.01)
CPC G01R 1/0416 (2013.01) [G01R 1/0433 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A test carrier, comprising:
a carrier body that holds a device under test (DUT) tested by a testing apparatus, and
a lid member that is attached to the carrier body and covers the DUT, wherein
the carrier body has a first through-hole that penetrates the carrier body and faces the DUT such that a part of the DUT is visible from outside of the test carrier, through the first through-hole by an imaging device that captures an image of the DUT through the first through-hole and acquires a relative position of a feature point of the DUT with respect to the first through-hole for positioning the DUT with respect to the carrier body,
the test carrier is configured to be carried to a socket fixed to the testing apparatus,
the socket and the DUT are electrically connected via the test carrier during testing of the DUT, and
the DUT is a die formed by dicing a semiconductor wafer.