US 12,276,672 B2
Sensor device
Moriyuki Shimizu, Yokkaichi (JP); Masaharu Nakamura, Yokkaichi (JP); Rieko Nagao, Yokkaichi (JP); Hiroki Muramatsu, Yokkaichi (JP); Koichi Kato, Yokkaichi (JP); Toshinari Kobayashi, Yokkaichi (JP); Yukitoshi Terasaka, Yokkaichi (JP); and Kyungwoo Kim, Yokkaichi (JP)
Assigned to Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
Appl. No. 17/907,319
Filed by Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
PCT Filed Mar. 12, 2021, PCT No. PCT/JP2021/010048
§ 371(c)(1), (2) Date Sep. 26, 2022,
PCT Pub. No. WO2021/193142, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-057491 (JP), filed on Mar. 27, 2020.
Prior Publication US 2023/0110687 A1, Apr. 13, 2023
Int. Cl. G01P 1/02 (2006.01); H01B 7/02 (2006.01); H01B 7/282 (2006.01); H05K 7/02 (2006.01)
CPC G01P 1/02 (2013.01) [H01B 7/02 (2013.01); H01B 7/282 (2013.01); H05K 7/02 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a sensor element;
a wiring member connected to the sensor element;
a first resin molded part that covers the sensor element and an end portion of the wiring member;
a second resin molded part molded separately from the first resin molded part and combined with the first resin molded part into an integral piece; and
wherein the first resin molded part includes a plurality of resin-stopping annular protrusions, and the second resin molded part covers a portion of the first resin molded part while the second resin molded part is continuous with one of the plurality of resin-stopping annular protrusions.