US 12,276,618 B2
Defect inspection device
Kazuhide Sato, Tokyo (JP); Yukihisa Mohara, Tokyo (JP); and Masami Makuuchi, Tokyo (JP)
Assigned to Hitachi High-Tech Corporation, Tokyo (JP)
Appl. No. 18/029,183
Filed by Hitachi High-Tech Corporation, Tokyo (JP)
PCT Filed Oct. 30, 2020, PCT No. PCT/JP2020/040937
§ 371(c)(1), (2) Date Mar. 29, 2023,
PCT Pub. No. WO2022/091380, PCT Pub. Date May 5, 2022.
Prior Publication US 2024/0027361 A1, Jan. 25, 2024
Int. Cl. G01N 21/93 (2006.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01)
CPC G01N 21/93 (2013.01) [G01N 21/8806 (2013.01); G01N 21/9501 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A defect inspection device that inspects a defect of a sample by irradiating the sample with light, the defect inspection device comprising:
a light source configured to irradiate the sample with the light;
a detector configured to detect signal light generated by irradiating the sample with the light and output a detection signal indicating intensity of the signal light;
a control unit configured to control an operation state of the detector; and
a calculation unit configured to acquire and process the detection signal output by the detector,
wherein the calculation unit acquires the detection signal related to the sample under a first signal acquisition condition,
wherein the calculation unit acquires the detection signal related to the same sample for which the detection signal is acquired in the first signal acquisition condition under a second signal acquisition condition different from the first signal acquisition condition, and
wherein the control unit controls the detector such that a first operation state of the detector in the first signal acquisition condition is identical to a second operation state of the detector in the second signal acquisition condition.