| CPC C25D 5/627 (2020.08) [C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 5/14 (2013.01); C25D 5/34 (2013.01); C25D 5/50 (2013.01)] | 12 Claims |
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1. A process method for controlling a glossiness of an electroplated nickel-layer to 290-310 Gu, comprising:
subjecting a metal substrate to pre-treatment, copper plating process, satin-nickel plating process, semi-bright-nickel plating process, and post-treatment in turn;
wherein an obtained product sheet with the electroplated nickel-layer prepared by the process method has the glossiness of 290-310 Gu;
wherein a temperature of a copper plating electrolyte used in the copper plating process is 64-68° C., a plating layer in the copper plating process has a roughness Ra of 0.1-0.3, the plating layer in the copper plating process comprises copper;
wherein a first nickel-layer is obtained by the satin-nickel plating process; the satin-nickel plating process has a current density of 2-3 A/dm2; a satin-plating electrolyte used in the satin-nickel plating process has a pH of 3.8-4.2; the first nickel-layer is a satin-nickel layer; and
wherein a second nickel-layer is obtained by the semi-bright-nickel plating process; the semi-bright-nickel plating process has a current density of 2-3 A/dm2; a semi-bright-nickel electrolyte used in the semi-bright-nickel plating process has a pH of 4.2-4.6; the second nickel-layer is a semi-bright-nickel layer.
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