US 12,276,029 B2
Metallic particle-deposition substrate, method and application thereof for increasing heterointerface
Bing-Joe Hwang, Taipei (TW); Wei-Nien Su, Taipei (TW); Meng-Che Tsai, Taipei (TW); and Sheng-Chiang Yang, Taipei (TW)
Assigned to National Taiwan University of Science and Technology, Taipei (TW)
Filed by National Taiwan University of Science and Technology, Taipei (TW)
Filed on May 11, 2022, as Appl. No. 17/741,642.
Claims priority of application No. 202111141367.1 (CN), filed on Sep. 28, 2021; and application No. 110136025 (TW), filed on Sep. 28, 2021.
Prior Publication US 2023/0095521 A1, Mar. 30, 2023
Int. Cl. C23C 2/04 (2006.01)
CPC C23C 2/04 (2013.01) 5 Claims
OG exemplary drawing
 
1. A Raman spectrometry test specimen comprises a metallic particle-deposition substrate, the metallic particle-deposition substrate comprising:
a metal substrate comprising a first metallic material;
a plurality of metallic particles on a surface of the metal substrate in a single particulate layer, the metallic particles are nanoparticles, wherein the metallic particles comprise a second metallic material different from the first metallic material, wherein at least 50% of the metallic particles do not contact or overlap and are attached to at least 50% of the surface of the metal substrate; and
an alloy layer at an interface between the metal substrate and the metallic particles, the alloy layer having a thickness less than 50 nm;
wherein a material of the alloy layer is a combination of the first metallic material and the second metallic material; and
wherein at least 50% of the metallic particles have each metallic particle in a distance at a range of between 0.5 nm and 100 nm between each individual adjacent metallic particle.