US 12,276,027 B2
Substrate processing apparatus and substrate processing method
Katsuhiro Morikawa, Koshi (JP); Masami Akimoto, Koshi (JP); Mitsuaki Iwashita, Nirasaki (JP); and Satoshi Kaneko, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Appl. No. 17/598,597
Filed by Tokyo Electron Limited, Tokyo (JP)
PCT Filed Mar. 24, 2020, PCT No. PCT/JP2020/012979
§ 371(c)(1), (2) Date Sep. 27, 2021,
PCT Pub. No. WO2020/196506, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-063372 (JP), filed on Mar. 28, 2019.
Prior Publication US 2022/0154342 A1, May 19, 2022
Int. Cl. C23C 18/16 (2006.01); C23C 18/18 (2006.01); H01L 21/02 (2006.01); H01L 21/288 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC C23C 18/1689 (2013.01) [C23C 18/163 (2013.01); C23C 18/1827 (2013.01); H01L 21/02068 (2013.01); H01L 21/288 (2013.01); H01L 21/6723 (2013.01); H01L 21/67748 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a liquid processing module, provided with a carry-out/in opening for a substrate, including therein a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in opening than the first liquid processing device;
a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and
a module-inside transfer device disposed between the first liquid processing device and the second liquid processing device, and configured to transfer the substrate between the first liquid processing device and the second liquid processing device,
wherein the first liquid processing device is equipped with a first holder configured to hold the substrate,
the second liquid processing device is equipped with a second holder configured to hold the substrate,
the second liquid processing device is configured to perform a plating processing on the substrate held by the second holder, and
the first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder,
wherein the module-inside transfer device comprises a first arm and a second arm which are configured to pivot in a horizontal plane by a rotary actuator, and
the first arm and the second arm are located at different height positions such that the first arm and the second arm do not interfere with each other when the first arm and the second arm are simultaneously moved.